Silicone is the preferred material in the wound care industry due to its excellent biocompatibility, it is very soft and can provide good adhesion to skin, it is ideal ingredients for wound care.Silicone can keep the scar moist which can help to prevent scar become dry and hard.Silicone can help to keep the wound moist and provide excellent permeability to release CO2, O2 and vapour during wound is recovering.Silicone can easily pass the selected test of ISO 10993 and USP Class VI certificationProductPropertyViscosity (mPa.s)working time(min@25°C)Cure ConditionPenetration(1/4 Core)9186UHExtra High tacky, transparency18000>602mm layer<10 min@120°C709186HHigh tacky, transparency18000>602mm layer<10 min@120°C709186High tacky, Easy for cutting and Mixing 12000>602mm layer<10 min@120°C709186HSHigh tacky, High Strength, Easy for cutting and Mixing12000>602mm layer<10 min@120°C709186LGood tacky, easy for defoaming12000>6010 min@100°C70TP100Primer,good Adhesion to Various substrate Paste like6 months15 min@120°CShore 00 75 

Thermal conductive materials：Silicone can make different thermal conductive material based on different silicone curing type which just need add thermal conductive fillers into silicone.Then it can dissipate the heat from electronic components, improve the its service life.Thermal conductive indexRTV-12-part pottingGrease1-part heat cure gel2-part Gap filler1-part heat cure adhesion2-part heat cure adhesion0.8508976051081510971051101.5971551151.892182972051205220922098202.1972152212.5512592252.65279727512635130923093353.59735523592353.892365.55155652606.592657557089280 

Silicon-based glue is clear and transparent, with a transmittance of over 99%. It is widely used in the screen lamination industry, especially bringing many advantages to full lamination:Reduce optical loss, improve readability, and increase contrast by>300%Improve resistance to heat, moisture and temperature cycling to extend service life,Improving the impact resistance of displays.Reduce power consumption and extend battery life.ProductPropertyViscosity (mPa.s)Working time(min/25°C)Cure time (min/60°C)Penetration(9.38g core)9106dispense：good adhesion20007015Shore 00 109102 Filling, good adhesion500-100060-24020609106UVSlit coating：high adhesion2000>24 hoursUV 1-10minShore 00 109162UV-45Stencil coating, high viscosity50000>24 hoursUV 1-10minShore 00 459142Aerospcae：low temperature to -60℃。6007015609153High reflective index(1.53)7507025659108Slit coating：higher viscosity1200018030608245UVSlit coating, good adhesion to PC/PMMA6000   3 months20Shore 00 45

Silicone is the preferred product in the IGBT industry due to its excellent resistance to high and low temperaturesLow ion content provides the best insulation protection for chips.The stress is extremely low because its modulus is less than 0.01, reducing the stress received by the chip.Hantek use clean room production to meet the requirements of precision electronics.High temperatures up to 210℃, meeting the high temperature requirements of SiC chips.Low temperature resistance to minus 60℃, meeting the low-temperature needs of special applications ProductPropertyViscosity (mPa.s)working time(min@25°C)Cure ConditionPenetration(1/4 Core)9102High tacky, transparency10007010 min@100°C709102UVUV cure, High tacky, transparency1000>2 daysUV curing+ heat curing709105Higher hardness, high temperature to 210°C 10006015 min@100°C409125Low viscosity, transparency50036025 min@100°C809146Good adhesion10007010 min@100°CShore 00 408888Case sealing and and adhesion, no bubble generate Paste like6 months15 min@150°CShore A 355100/51201-3W/m.K thermal conductive grease100000Long life timeNo needN/A9142-450Lower viscosity，low temperature to  -60°C 45024025 min@100°C60

Silicone is widely used in the automotive electronics industry due to its excellent resistance to high and low temperatures and good UV- resistance. Mainly used for sealing, bonding, potting, thermal conductivity, circuit board coating, and other applications.ProductPropertyViscosity (mPa.s)Cure(min@°C)Hardness (Shore A)Strength(Mpa)9520flowable，low compression set4000010min@100°C403.09888Case sealing and adhesionNo-sag30min@120°C353.09735Thermal conductive potting, 3.5W/m.K1100030min@80°C5519115Adhesion and Potting120045min@80°C1518888CIPG use, low compression setNone sag45min@150°C 353.58888UVCIPG and FIPG use, None sagLED 365nm 5000mJ/ cm 2 +30min@80°C 403.556406:1, sealing and adhesionNo-sag60min@25°C401.857305:1，potting and adhesion100060min@25°C351.08501Good adhesion, flowable,PCB coating and PIN coating10000130℃/40min2519225Gap filler, 2.5W/m.K20000010min@100°CShore 00 700.29335Thermal conductive adhesion, 3.5W/m.K15000030min@125°C9529156 UVTransparent, low viscosity PCB coating and PIN coating200LED 365nm 5000mJ/ cm 2Shore 00 40    0.35091General sealingNo-sagmoisture351.5922Fluoro-silicone gel， oil-resistance70015 min@120°C85(penetration)0.2